Open Access
Oil & Gas Science and Technology - Rev. IFP
Volume 60, Numéro 4, July-August 2005
Dossier: Software Interoperability for Petroleum Applications
Page(s) 721 - 730
Publié en ligne 1 décembre 2006
  • Baker, A. et al. (1995) Permanent Monitoring - Looking at Lifetime Reservoir Dynamics. Oilfield Review, 7, 4, 32-56. [Google Scholar]
  • Beamer, A. et al. (1998) From Pore to Pipeline, Field-Scale Solutions. Oilfield Review, 10, 2, 2-19. [Google Scholar]
  • Schmumberger, Oilfield Glossary, Retrieved on September 1, 2004 from [Google Scholar]
  • Eck, J. et al. (1999) Downhole Monitoring: The Story So Far. Oilfield Review, 20-33. [Google Scholar]
  • Den Boer, J.J. (1999) The Use of High Temperature Electronics in Downhole Applications. HITEN Conference in Berlin, 149-152. [Google Scholar]
  • Colwell, B. (Jan 2002) Phrenology, Astrology, Risk, and Product Quality. Computer, 35, 1, 12-14. [Google Scholar]
  • Bailey, W.,Couet, B.,Lamb, F.,Simpson, G., and Rose, P. (2000) Taking a Calculated Risk. Oilfield Review, 12, 3, 20-35. [Google Scholar]
  • Rhea, J. (1999) Custom components: Surviving in a COTS World. Military & Aerospace Electronics, 10, 7. [Google Scholar]
  • Magrab, E. et al. (1997) Perspectives to Understand Risks in the Electronic Industry. IEEE Transaction on Components Packaging and Manufacturing Technology, Part A, 20, 4, 542-547. [CrossRef] [Google Scholar]
  • Ferris-Prabhu, A.V. (1992) Introduction to Semiconductor Device Yield Modeling, Boston, MA, Artech House. [Google Scholar]
  • Burnett, N. et al. (1993) Quality. Oilfield Review, 5, 3, 46-59. [Google Scholar]
  • Jackson, M.,Mathur, A.,Pecht, M. and Kendall, R. (1999) Part Manufacturer Assessment Process. Quality and Reliability Engineering International, 15, 457-468. [CrossRef] [Google Scholar]
  • Pecht, M., Lall, P., and, Hakim, E. (1997) Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure, CRC Press, New York. [Google Scholar]
  • Das, D., Pendse, N., Wilkinson and C.Pecht, M., (2001) Parameter Recharacterization: A Method of Thermal Uprating. IEEE Transactions on Components and Packaging Technologies, 24, 4, 729-737. [CrossRef] [Google Scholar]
  • Pecht, M.G.,Das, D., and Ramakrishnan, A. (2002) The IEEE Standards on Reliability Program and Reliability Prediction Methods for Electronic Equipment. Microelectronic Reliability, 42, 1259-1266. [Google Scholar]
  • Veneruso, A.F., Kosmala, A.G., Bhavsar, R., Bernard, L.J., and Pecht, M. (2001) Engineered Reliability for Intelligent Well Systems. Offshore Technology Conference, OTC 13031. [Google Scholar]
  • Hansen, H.,Myers, S.,Redd, E., and Shannon, R. (1993) Pursuing the Case for Safety. Oilfield Review, 5, 3, 36-45. [Google Scholar]
  • Office of Natural Gas and Petroleum Technology, Oil & Gas Environmental Research & Analysis Program, Retrieved on Septemberber 1, 2004 from [Google Scholar]
  • Ciocci, R. and Pecht, M. (2004) Questions Concerning the Migration to Lead-free Solder. Circuit World, 30, 2, 34-40. [CrossRef] [Google Scholar]
  • International Bureau of WIPO, WIPO’s Development Cooperation Activities, WIPO/CNR/ABU/93/9. [Google Scholar]
  • Heejin., J., and Sangwood, K.(2000) A Self-Extension Monitoring for Security Management. Computer Security Applications, ACSAC 16th Annual Conference, 196-203. [Google Scholar]
  • Jackson, M.,Sandborn, P.,Pecht, M.,Davis, C.M. and Audette, P. (1999) A Risk-Informed Methodology for Parts Selection and Management. Quality and Reliability Engineering International, 15, 261-271. [CrossRef] [Google Scholar]
  • Syrus, T,Pecht, M., and Humphrey, D. (2001) Part Assessment Guidelines and Criteria for Parts Selection and Management. IEEE Transactions on Electronics Packaging Manufacturing, 24, 4, 339-350. [CrossRef] [Google Scholar]
  • Syrus, T,Pecht, M., and Uppalapati, R. (2001) Manufacturer Assessment Procedure and Criteria for Parts Selection and Management. IEEE Transactions on Electronics Packaging Manufacturing, 24, 4, 351-358. [CrossRef] [Google Scholar]
  • Tiku, S. and Pecht M. (2003) Auditing the Reliability Capability of Electronics Manufacturers. Proceedings of ASME International Electronic Packaging Technical Conference and Exhibition, Maui, Hawaii, USA. [Google Scholar]

Les statistiques affichées correspondent au cumul d'une part des vues des résumés de l'article et d'autre part des vues et téléchargements de l'article plein-texte (PDF, Full-HTML, ePub... selon les formats disponibles) sur la platefome Vision4Press.

Les statistiques sont disponibles avec un délai de 48 à 96 heures et sont mises à jour quotidiennement en semaine.

Le chargement des statistiques peut être long.