Table 2
Bonded parameters for the components of our simulation systems: bonds.
Bond | kr (kcal/mol. Å2) | r0 (Å) |
---|---|---|
Si–OSiE | 302.0000 | 1.6980 |
Si–OSiH | 325.0000 | 1.6800 |
OSiH–HSiO | 566.0000 | 0.9750 |
OSiH–C | 363.2140 | 1.4150 |
C–F | 432.5890 | 1.3400 |
C–C | 224.3212 | 1.5250 |
OT–HT | 450.0000 | 0.9572 |
CM–CE | 222.5000 | 1.5300 |
CM–CM | 222.5000 | 1.5280 |
CM–HM | 309.0000 | 1.1110 |
CE–HE | 322.0000 | 1.1110 |