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Table 2

Bonded parameters for the components of our simulation systems: bonds.

Bond kr (kcal/mol. Å2) r0 (Å)
Si–OSiE 302.0000 1.6980
Si–OSiH 325.0000 1.6800
OSiH–HSiO 566.0000 0.9750
OSiH–C 363.2140 1.4150
C–F 432.5890 1.3400
C–C 224.3212 1.5250
OT–HT 450.0000 0.9572
CM–CE 222.5000 1.5300
CM–CM 222.5000 1.5280
CM–HM 309.0000 1.1110
CE–HE 322.0000 1.1110

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